Solid-state cooler device with grid point contacts
US12426504B2 · kind B2 · utility
0Cited by
4References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 1, 2023 |
| Grant date | Sep 23, 2025 |
| Priority date | — |
| Expiry date | Aug 1, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N10/8552
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A solid-state cooler device is disclosed that includes a first portion having a normal metal heat sink layer and a plurality of first parallel ridges disposed over the normal metal heat sink layer, and a second portion having a normal metal layer, insulator layer, superconductor layer (NIS) junction and a plurality of second parallel ridges disposed over the superconductor layer of the NIS junction. The plurality of first parallel ridges are in contact and orthogonal to the plurality of second parallel ridges to provide a plurality of grid point contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.