CMP composition including an anionic abrasive
US12428580B2 · kind B2 · utility
0Cited by
1References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2022 |
| Grant date | Sep 30, 2025 |
| Priority date | — |
| Expiry date | Feb 20, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A chemical mechanical polishing composition comprises, consists of, or consists essentially of a liquid carrier, anionic particles dispersed in the liquid carrier, an anionic polymer or surfactant, and a cationic polymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.