Cerium oxide abrasive particles and polishing slurry composition
US12428584B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Aug 29, 2022 |
| Grant date | Sep 30, 2025 |
| Priority date | — |
| Expiry date | Jun 11, 2043 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1463
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present disclosure relates to cerium oxide abrasive particles and a polishing slurry composition, and more particularly, to cerium oxide abrasive particles comprising: an element cerium; and a modifier and satisfying the agglomeration ratios calculated from the relational expressions of the primary particle sizes and the secondary particle sizes, and a polishing slurry composition comprising the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.