Internal recirculation cooling module
US12432878B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2024 |
| Grant date | Sep 30, 2025 |
| Priority date | — |
| Expiry date | Jul 18, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Improved cooling modules and methods are configured to recirculate the liquid coolant fluid inside the cooling modules so that the same liquid cooling fluid impinges the surfaces of the heat-generating electronic components (or cooling plates in thermal communication with the heat-generating electronic components) multiple times before exiting the cooling module, thereby allowing a given flow of coolant fluid to be re-used several times over. With each re-use of the coolant fluid, the flow rate demand drops, reducing infrastructure required to achieve higher performance in direct and indirect micro-convective impingement cooling applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.