JetCool Technologies Inc.
12Patents
12Active
12Granted
62Portfolio score
Filing activity: May 13, 2020 → Jul 18, 2024
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11277937B2 | Re-entrant flow cold plate | Electricity | 6 | Active |
| US11191184B2 | Direct contact fluid based cooling module | Electricity | 5 | Active |
| US11844193B2 | Direct contact fluid based cooling module | Electricity | 3 | Active |
| US11963341B2 | High temperature electronic device thermal management system | Electricity | 1 | Active |
| US12100643B2 | Thermal management of electronics using co-located microjet nozzles and electronic elements | Electricity | 1 | Active |
| US12016157B2 | Actively cooled heat-dissipation lids for computer processors and assemblies | Electricity | 1 | Active |
| US12048118B2 | Flow-through, hot-spot-targeting immersion cooling assembly | Emerging Cross-Sectional Technologies | 1 | Active |
| US12324126B2 | Actively cooled heat-dissipation lids for computer processors and processor assemblies | Electricity | 0 | Active |
| US12289871B2 | High temperature electronic device thermal management system | Electricity | 0 | Active |
| US12288733B2 | Conformal cooling assembly with substrate fluid-proofing for multi-die electronic assemblies | Electricity | 0 | Active |
| US12432878B2 | Internal recirculation cooling module | Electricity | 0 | Active |
| US12289861B2 | Liquid-in-liquid cooling system for electronic components | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.