Cooling approaches for stitched dies
US12432897B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2021 |
| Grant date | Sep 30, 2025 |
| Priority date | — |
| Expiry date | Jan 30, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L24/18
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Stitched dies having a cooling structure are described. For example, an integrated circuit structure includes a first die including a first device layer and a first plurality of metallization layers over the first device layer. The integrated circuit structure also includes a second die including a second device layer and a second plurality of metallization layers over the second device layer, the second die separated from the second die by a scribe region. A common conductive interconnection is coupling the first die and the second die at a first side of the first and second dies. A plurality of microfluidic channels is coupled to the first side of the first and second dies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.