Microwave transistor package
US3936864A · kind A · utility
32Cited by
6References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 4, 1974 |
| Grant date | Feb 3, 1976 |
| Priority date | — |
| Expiry date | Oct 4, 1994 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30111
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microwave transistor package which will accommodate large transistor chips as well as provide sufficient space for the addition of tuning capacitors or other circuits. The lead length inside of the package is minimized. A ceramic mounting pad is brazed to an underlying copper base and a nickel aperture plate is mounted around the mounting pad. The amount of ceramic material used is much less than in prior art devices. Tuning capacitors or other devices are mounted upon the top surface nickel spacer and connected to the transistor chip. In the preferred embodiment, the entire package is hermetically sealed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.