Patent · US Expired

Process for simultaneous development and etch of photoresist and substrate

US3944421A · kind A · utility

10Cited by
4References
4Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 3, 1973
Grant dateMar 16, 1976
Priority date
Expiry dateOct 3, 1993

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG03F7/32
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

Photoresists are developed and the supporting substrate is etched simultaneously therewith by bringing the resist (after exposure) into physical contact with a fluid containing a developer for the resist and an etchant for the supporting substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.