Functional alloy for use in automated soldering processes
US3945556A · kind A · utility
6Cited by
4References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 25, 1975 |
| Grant date | Mar 23, 1976 |
| Priority date | — |
| Expiry date | Feb 25, 1995 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/262
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A solder alloy for use in automated soldering of workpieces by application thereto of liquid solder from a molten reservoir. The alloy consists essentially of from about 50 to 57.5% by weight tin, from about 1.5 to 4% by weight antimony, with the balance being substantially lead. The alloy is preferably further characterized in displaying a solidus-to-liquidus temperature range no greater than that of a 60/40 weight ratio tin/lead solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.