Patent assignee · US · COMPANY

Alpha Metals, Inc.

23Patents
5Active
23Granted
39Portfolio score

Filing activity: Aug 12, 1974 → Jun 24, 2011 · 2 expiring within 5 years

Most-cited patents

PatentTitleAreaCited byStatus
US5879808A Parylene polymer layers Emerging Cross-Sectional Technologies 47 Expired
US6194788A Flip chip with integrated flux and underfill Emerging Cross-Sectional Technologies 36 Expired
US5955141A Process for silver plating in printed circuit board manufacture Chemistry; Metallurgy 29 Expired
US6319543A Process for silver plating in printed circuit board manufacture Chemistry; Metallurgy 26 Expired
US6051276A Internally heated pyrolysis zone Chemistry; Metallurgy 13 Expired
US6074803A Bonding inner layers in printed circuit board manufacture Electricity 11 Expired
US3973572A Self-purging apparatus for determining the quantitative presence of derived ions Emerging Cross-Sectional Technologies 11 Expired
US8555491B2 Methods of attaching a die to a substrate Emerging Cross-Sectional Technologies 10 Active
US6294220A Post-treatment for copper on printed circuit boards Chemistry; Metallurgy 10 Expired
US6323062A Wafer coating method for flip chips Electricity 10 Expired
US6440647B1 Resist stripping process Electricity 10 Expired
US4086179A Improved cleaning solvent containing non-azeotropic mixtures of 1,1,1-trichloroethane and n-propanol Chemistry; Metallurgy 8 Expired
US6123024A Stencil incorporating electronic tag Performing Operations; Transporting 8 Expired
US4009816A Method and apparatus for increasing efficiency of a foam fluxer used in wave soldering of printed wiring boards Electricity 7 Expired
US3945556A Functional alloy for use in automated soldering processes Performing Operations; Transporting 6 Expired
US6017983A Color indicator for completion of polymerization for thermosets Chemistry; Metallurgy 6 Expired
US9221131B2 Solder alloy Chemistry; Metallurgy 4 Active
US6158339A Stencil holder assembly for use with solder paste stencil printers Performing Operations; Transporting 2 Expired
US9217088B2 Particles and inks and films using them Emerging Cross-Sectional Technologies 2 Active
US8597548B2 Solvent systems for metals and inks Electricity 1 Active
US8564140B2 Mono-acid hybrid conductive composition and method Electricity 1 Active
US6096808A Snap cure adhesive based on anhydride/epoxy resins Electricity 0 Expired
USRE29563E Functional alloy for use in automated soldering processes General 0 Expired

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.