Method for fabricating glass-backed transducers and glass-backed structures
US3951707A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 15, 1974 |
| Grant date | Apr 20, 1976 |
| Priority date | — |
| Expiry date | Apr 15, 1994 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A glass or other dielectric backed transducer structure is formed by utilizing a series of processes including at least one electrostatic bond. The processes enable one to bond a semiconductor wafer to a dielectric as a glass wafer. Then by selectively removing certain conductively semiconductor, one obtains a "thin ribbon" piezoresistive bridge secured to a thin glass wafer. The resultant structure is entirely unanticipated by the prior art. A glass part is also formed by electrostatically bonding a glass wafer to a semiconductor wafer, polishing the glass to a desired depth, masking the polished glass layer according to a desired pattern representative of the glass part, etching away all the glass except the desired pattern, and thence removing all the semiconductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.