Method of connecting electronic microcomponents
US3981076A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 27, 1974 |
| Grant date | Sep 21, 1976 |
| Priority date | — |
| Expiry date | Nov 27, 1994 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of connecting electronic microcomponents comprising the steps of realizing a support with conducting wire connecting pads secured on said support, the position of which is adapted to the arrangement of the connections for the microcomponents, making a connecting circuit by sticking an insulated wire onto said support and connecting said conducting wire connecting pads, positioning the microcomponent panels so that each microcomponent connection is in electrical contact with one of said wire connecting pads, welding the connections to their respective wire connecting pads. A substrate for connecting microcomponents comprising a support on which conducting wire connecting pads are deposited and joined by a connecting circuit made of insulated wire. A hybrid circuit comprising a number of electronic microcomponents connected by said substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.