Gerard Nicolas
12Patents
9h-index
10Co-inventors
69Inventor score
Filing activity: Nov 27, 1974 → Nov 24, 1998
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5373189A | Three-dimensional multichip module | Electricity | 148 | Expired |
| US6159323A | Process for selective transfer of a microstructure formed on an initial substrate to a final substrate | Electricity | 30 | Expired |
| US4684181A | Microconnector with a high density of contacts | Electricity | 23 | Expired |
| US3981076A | Method of connecting electronic microcomponents | Emerging Cross-Sectional Technologies | 22 | Expired |
| US4031612A | Method and a device for the interconnection of electronic components | Emerging Cross-Sectional Technologies | 20 | Expired |
| US4671593A | Microconnector with high contact density | Electricity | 17 | Expired |
| US4255853A | Method for interconnecting the terminals of electrical assemblies | Emerging Cross-Sectional Technologies | 16 | Expired |
| US5450206A | Process and device for checking the conformity of hybridization balls | Electricity | 15 | Expired |
| US4337573A | Method for constructing an electrical interconnection circuit and apparatus for realizing the method | Emerging Cross-Sectional Technologies | 9 | Expired |
| US5776791A | Process for collective manufacture of chips with electrodes selectively covered by a deposit | Chemistry; Metallurgy | 7 | Expired |
| US4761517A | Electrical connections with controlled thermal and electrical resistances | Electricity | 7 | Expired |
| US5636683A | Heating device for embodying connections by a meltable material | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.