Electroplating method
US3996114A · kind A · utility
Assignees
Inventor
Key dates
| Filing date | Dec 17, 1975 |
| Grant date | Dec 7, 1976 |
| Priority date | — |
| Expiry date | Dec 17, 1995 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D15/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A layer of metal having a plurality of discrete particles of a finely divided solid non-metallic material uniformly dispersed throughout the metal layer is electrodeposited onto the surface of a substrate metal by first applying an amphoteric surfactant having a substituted imidozolinium structure to the surface of the particles of finely divided non-metallic solid material, or by first introducing the said amphoteric surfactant into the electrolyte solution. The said particles and the said metal are then co-deposited onto the substrate metal from an aqueous acidic electrolyte solution containing metalliferous cations of the said metal in solution and the said particles in suspension therein. Specifically, the amphoteric surfactant employed is selected from the group of substituted imidozolinium derivatives having the chemical structure: ##STR1## Where R is a fatty acid radical having from 6 to 18 carbon atoms. R.sup.1 is H, Na or CH.sub.2 COOM PA1 R.sup.2 is COOM, CH.sub.2 COOM or CH(OH)CH.sub.2 SO.sub.3 M PA1 R.sup.3 is OH PA1 M is H or Na or an organic base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.