John L. Raymond
5Patents
0Active
5Granted
28Portfolio score
Filing activity: Dec 17, 1975 → Nov 14, 1997
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5843538A | Method for electroless nickel plating of metal substrates | Chemistry; Metallurgy | 251 | Expired |
| US3996114A | Electroplating method | Chemistry; Metallurgy | 25 | Expired |
| US4105534A | Apparatus for removing impurities from electrolyte solutions | Performing Operations; Transporting | 14 | Expired |
| US4043878A | Electroplating method | Chemistry; Metallurgy | 10 | Expired |
| US4670312A | Method for preparing aluminum for plating | Chemistry; Metallurgy | 9 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.