High sensitivity resist system for lift-off metallization
US4024293A · kind A · utility
21Cited by
3References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 10, 1975 |
| Grant date | May 17, 1977 |
| Priority date | — |
| Expiry date | Dec 10, 1995 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/143
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
High sensitivity resist films for lift-off metallization are formed by coating a substrate with at least two layers of polymeric materials, each layer of which is developed by different developers that are mutual exclusive of one another. The resist can operate for lift-off at electron beam exposure equal to or greater than 5.times.10.sup.-.sup.6 coulombs/cm.sup.2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.