Method and a device for the interconnection of electronic components
US4031612A · kind A · utility
20Cited by
3References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 2, 1976 |
| Grant date | Jun 28, 1977 |
| Priority date | — |
| Expiry date | Mar 2, 1996 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/514
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Different conductive zones on an insulating base support are interconnected by bonding an insulated wire to the support. In order to establish electric contacts between conductive zones and the conductive core of the insulated wire, the wire is stripped, soldered onto the conductive zones and cut after soldering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.