Electroplating method
US4043878A · kind A · utility
Assignees
Inventor
Key dates
| Filing date | Jun 14, 1976 |
| Grant date | Aug 23, 1977 |
| Priority date | — |
| Expiry date | Jun 14, 1996 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D15/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A layer of metal having a plurality of discrete particles of a finely divided solid non-metallic material uniformly dispersed throughout the metal layer is electrodeposited onto the surface of a substrate metal by first applying a tertiary amine oxide surfactant to the surface of the particles of finely divided non-metallic solid material, or by first introducing the said tertiary amine oxide surfactant into the electrolyte solution. The said particles and the said metal are then co-deposited onto the said substrate from an aqueous electrolyte solution containing metaliferous cations of the said metal in solution and the said particles in suspension therein. Specifically, the tertiary amine oxide surfactant employed is selected from the group having the chemical structure: ##STR1## Where R.sub.1 is an alkyl, alkene or alkyne radical having from 6 to 22 carbon atoms, R.sub.2 is an alkyl or hydroxyalkyl radical having from 1 to 4 carbon atoms, and R.sub.3 is alkyl or hydroxyalkyl radical having from 1 to 4 carbon atoms.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.