Packaging of semiconductor discs

US4057142A · kind A · utility

Assignee

• Wacker-Chemitronic Gesellschaft fur Elektronik Grundstoffe mbH · DE

Inventors

• Gunther Lechner · Herrsching am Ammersee, DE
• Karl Pritscher
• Helmut Kirschner · Munich, DE

Key dates

• Filing date: Jul 26, 1976
• Grant date: Nov 8, 1977
• Expiry date: Jul 26, 1996

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B65D77/0406
• WIPO field: Handling
• WIPO sector: Mechanical engineering

Abstract

A stackable plastics pallet for packaging semiconductor discs on a gas-ti foil covering, said pallet having a plurality of circular depressions each for accommodating a semiconductor disc, and means for securing the discs between the pallets, the securing means being in the form of sloping part-sector shaped surfaces surrounding said depressions, with two opposite sets of sloping surfaces clamping the semiconductor discs at their outermost rims and immobilizing them thereby.