Process for making hollow silicon bodies and bodies utilizing board-shaped members to form the basic geometric shape so made

US4062714A · kind A · utility

Assignee

• Wacker-Chemitronic Gesellschaft fur Elektronik Grundstoffe mbH · DE

Inventors

• Rudolf Griesshammer · Altötting, DE
• Franz Koppl · Altötting, DE
• Alois Goppinger
• Helmut Hamster · Burghausen, DE
• Josef Thalmeier · Wil, CH

Key dates

• Filing date: Jul 13, 1976
• Grant date: Dec 13, 1977
• Expiry date: Jul 13, 1996

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C30B31/10
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A process for making hollow silicon bodies by decomposition from a gaseous ompound containing silicon and depositing said silicon on heated carrier bodies, which comprises assembling in a decomposition device a number of board-shaped members of silicon to form a hollow carrier body, heating said body to the decomposition temperature of the gaseous compound, introducing the gas into the device whereby it is thermally decomposed, causing the silicon released thereby to become inseparately united with the hollow carrier body, the hollow silicon body so formed being immediately available for use in the semiconductor industries. The invention also comprises the silicon bodies so made.