High speed precision chuck assembly
US4066943A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 10, 1975 |
| Grant date | Jan 3, 1978 |
| Priority date | — |
| Expiry date | Nov 10, 1995 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T74/1476
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Testing of integrated circuit components of the silicon wafer type for grading purposes is accomplished by supporting the wafer matrix on a platform type work table which is indexed in an x-y coordinate fashion, with the work table being moved vertically to a test position such that the test probes make contact with a precise predetermined position corresponding to the precise location of that portion of the integrated circuit to be tested. The work table is movable vertically with reference to a predetermined axis and rotatable with respect thereto such that the surface of the table remains perpendicular to the reference axis. The chuck assembly for moving the table includes a housing having a bore whose center forms the axis, with a chuck plate mounted for sliding movement in the bore. The end of the chuck plate is in the form of a flanged spool which receives bearing-eccentric assembly for effecting vertical movement while permitting rotation of the spool and the attached chuck plate. A multiphase stepping motor is used to drive the chuck plate through the bearing-eccentric assembly, the motor including optical limit switches sensing the motor shaft position and controlling the …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.