Apparatus for thermal diffusion of semiconductor devices
US4075972A · kind A · utility
12Cited by
10References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 16, 1976 |
| Grant date | Feb 28, 1978 |
| Priority date | — |
| Expiry date | Aug 16, 1996 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/14
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention discloses an apparatus for thermal diffusion of semiconductor devices, wherein a plurality of wafer boats each made of a refractory material and adapted to carry a predetermined number of wafers to be processed are sequentially fed into a furnace tube containing a high temperature, diffusion gas atmosphere and continuously transported at a predetermined speed through the furnace tube so that each wafer may have substantially the same thermal treatment and high productivity may be attained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.