Single in-line high power resin-packaged semiconductor device having an improved heat dissipator
US4095253A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 23, 1976 |
| Grant date | Jun 13, 1978 |
| Priority date | — |
| Expiry date | Nov 23, 1996 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A single in-line, high power, resin-packaged semiconductor device having a plurality of external leads disposed in parallel to each other and projecting from one side surface of a resin-molded package, wherein a heat sink fin mounting plate is formed in unitary structure with a plate for carrying a semiconductor pellet and arranged to project from a recessed portion of the opposite side surface of the resin-molded package and a heat sink fin has one end bent in U-shape and caulked on the fin mounting plate and the remaining portion overlapping one principal surface of the resin-molded package. The projection of the heat sink fin from the resin-molded package can be reduced to enable the device to be assembled in compact electronic instruments or devices. Heat dissipation efficiency can also be improved by mounting the semiconductor device on a chassis with the heat sink fin brought in contact with the chassis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.