Keizo Otsuki
9Patents
9h-index
12Co-inventors
55Inventor score
Filing activity: Nov 23, 1976 → Jul 5, 1979
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4301464A | Lead frame and semiconductor device employing the same with improved arrangement of supporting leads for securing the semiconductor supporting member | Electricity | 201 | Expired |
| US4126292A | Mold die | Performing Operations; Transporting | 38 | Expired |
| US4095253A | Single in-line high power resin-packaged semiconductor device having an improved heat dissipator | Electricity | 25 | Expired |
| USD259783S | Semiconductor | General | 24 | Expired |
| USD260091S | Semiconductor | General | 23 | Expired |
| USD259560S | Semiconductor | General | 17 | Expired |
| USD259782S | Semiconductor | General | 16 | Expired |
| USD259559S | Semiconductor | General | 13 | Expired |
| USD260986S | Semiconductor | General | 11 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.