Method of providing semiconductor pellet with heat sink
US4123293A · kind A · utility
9Cited by
17References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 3, 1976 |
| Grant date | Oct 31, 1978 |
| Priority date | — |
| Expiry date | Mar 3, 1996 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of providing a silicon semiconductor pellet with a heat sink and a semiconductor device with such a heat sink. The heat sink to which the pellet is bonded with a eutectic alloy of gold and silicon interposed therebetween consists mainly of copper and contains a small amount of a metal other than copper and has been subjected to an annealing treatment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.