Susumu Okikawa
15Patents
12h-index
28Co-inventors
78Inventor score
Filing activity: Mar 3, 1976 → Feb 28, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4845543A | Semiconductor device and method of manufacturing the same | Electricity | 48 | Expired |
| US5031821A | Semiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the method | Electricity | 33 | Expired |
| US4998002A | Wire-bonding method, wire-bonding apparatus, and semiconductor device produced by the wire-bonding method | Electricity | 29 | Expired |
| US4100566A | Resin-sealed type semiconductor devices and manufacturing method of the same | Emerging Cross-Sectional Technologies | 25 | Expired |
| US5285949A | Wire-bonding method, wire-bonding apparatus, and semiconductor device produced by the wire-bonding method | Electricity | 23 | Expired |
| US4950866A | Method and apparatus of bonding insulated and coated wire | Electricity | 23 | Expired |
| US4976393A | Semiconductor device and production process thereof, as well as wire bonding device used therefor | Electricity | 21 | Expired |
| US5844310A | Heat spreader semiconductor device with heat spreader and method for producing same | Emerging Cross-Sectional Technologies | 18 | Expired |
| US6032362A | Method for producing a heat spreader and semiconductor device with a heat spreader | Emerging Cross-Sectional Technologies | 18 | Expired |
| US5152450A | Wire-bonding method, wire-bonding apparatus,and semiconductor device produced by the wire-bonding method | Electricity | 14 | Expired |
| US4564734A | Wire bonder | Electricity | 14 | Expired |
| US6419149B1 | Method for producing wiring layer transfer composite | Performing Operations; Transporting | 13 | Expired |
| US4791472A | Lead frame and semiconductor device using the same | Electricity | 12 | Expired |
| US4123293A | Method of providing semiconductor pellet with heat sink | Electricity | 9 | Expired |
| US4326215A | Encapsulated semiconductor device with a metallic base plate | Electricity | 6 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.