Power module with isolated substrates cooled by integral heat-energy-removal means
US4145708A · kind A · utility
38Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 1977 |
| Grant date | Mar 20, 1979 |
| Priority date | — |
| Expiry date | Jun 13, 1997 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The evaporating area of a heat pipe or thermosiphon evaporator is used as the thermal sink for one face of an electrically isolated substrate upon the opposite face of which are mounted and interconnected one or more power semiconductors and other components requiring cooling. Both sides of semiconductor devices mounted on the isolating substrate may be cooled while allowing each of a plurality of different combinations of electrical devices and/or interconnections to be achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.