Silverplated vapor deposition chamber

US4173944A · kind A · utility

Assignee

• Wacker-Chemitronic Gesellschaft fur Elektronik Grundstoffe mbH · DE

Inventors

• Franz Koppl · Altötting, DE
• Helmut Hamster · Burghausen, DE
• Rudolf Griesshammer · Altötting, DE
• Helmut Lorenz · Burghausen, DE

Key dates

• Filing date: Feb 14, 1978
• Grant date: Nov 13, 1979
• Expiry date: Feb 14, 1998

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C30B25/08
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

In a device and process for the deposition of pure semiconductor materials, specially silicon, by thermal decomposition of gaseous compounds of said semiconductor materials on carrier bodies heated to decomposition temperature, wherein the device consists of a silver plated base plate, mounting means and electrical connections thereon for heating the carrier bodies, as well as pipe connections for supply and exhaust of said gaseous compounds, and a bell-shaped cover slipped onto the base plate and forming a gas-tight seal therewith, the improvement that the area of the bell-shaped cover facing the reaction space consists of silver or silverplated steel.