Semiconductor device and a method of manufacturing the same
US4199777A · kind A · utility
19Cited by
6References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 2, 1977 |
| Grant date | Apr 22, 1980 |
| Priority date | — |
| Expiry date | Feb 2, 1997 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes at least two different elements having different functions. At least one of the elements is fixed within a recess provided in a substrate, and wirings are provided on an insulating film deposited commonly on the elements and the substrate, so that there is no step or clearance between the elements or between the element and the substrate, making it possible to easily form good interconnections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.