Multi-layer dielectric planar structure having an internal conductor pattern characterized with opposite terminations disposed at a common edge surface of the layers
US4202007A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 23, 1978 |
| Grant date | May 6, 1980 |
| Priority date | — |
| Expiry date | Jun 23, 1998 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The coating of a conductor pattern on dielectric green sheets to a common edge thereof with stacking or superimpositioning together of a plurality of sheets to enclose the conductor pattern followed by sintering, with the edge side of the fired body having the exposed end terminations becoming the actual face of the body on which a semiconductor device is mounted in electrical circuit connection to respective ones of the common end terminations of the conductor runs. The conductor runs are returned through the body to the active face of the body to position the opposite or distal ends of the conductors thereat, in an increased spaced relationship of the distal conductor terminations. For external connection, terminal pins may be embedded in the fired body for connection at adjacent and to the distal conductor termination, with the pins projecting therefrom.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.