Stuart E. Greer
14Patents
13h-index
21Co-inventors
78Inventor score
Filing activity: Jun 23, 1978 → Jan 18, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5470787A | Semiconductor device solder bump having intrinsic potential for forming an extended eutectic region and method for making and using the same | Electricity | 177 | Expired |
| US6346469B1 | Semiconductor device and a process for forming the semiconductor device | Electricity | 138 | Expired |
| US5468655A | Method for forming a temporary attachment between a semiconductor die and a substrate using a metal paste comprising spherical modules | Emerging Cross-Sectional Technologies | 125 | Expired |
| US6107180A | Method for forming interconnect bumps on a semiconductor die | Emerging Cross-Sectional Technologies | 109 | Expired |
| US6451681B1 | Method of forming copper interconnection utilizing aluminum capping film | Electricity | 80 | Expired |
| US6713381B2 | Method of forming semiconductor device including interconnect barrier layers | Electricity | 73 | Expired |
| US4202007A | Multi-layer dielectric planar structure having an internal conductor pattern characterized with opposite terminations disposed at a common edge surface of the layers | Electricity | 71 | Expired |
| US4602271A | Personalizable masterslice substrate for semiconductor chips | Electricity | 53 | Expired |
| US5597737A | Method for testing and burning-in a semiconductor wafer | Physics | 39 | Expired |
| US6689680B2 | Semiconductor device and method of formation | Electricity | 22 | Expired |
| US5104695A | Method and apparatus for vapor deposition of material onto a substrate | Chemistry; Metallurgy | 22 | Expired |
| US4861425A | Lift-off process for terminal metals | Emerging Cross-Sectional Technologies | 18 | Expired |
| US6117759A | Method for multiplexed joining of solder bumps to various substrates during assembly of an integrated circuit package | Electricity | 14 | Expired |
| US4598470A | Method for providing improved electrical and mechanical connection between I/O pin and transverse via substrate | Emerging Cross-Sectional Technologies | 12 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.