Apparatus for the treatment of a wafer by plasma reaction
US4208159A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 16, 1978 |
| Grant date | Jun 17, 1980 |
| Priority date | — |
| Expiry date | Jun 16, 1998 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/139
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved apparatus for the automatic handling of wafer materials is proposed for the plasma treatment of the wafers such as high-purity silicon semiconductor wafers. In this apparatus, the wafer carried by a carrier means to a position neighboring to a wafer table is picked up by a movable pick-up means and placed on the wafer table where it is subjected to the plasma treatment after the wafer table is fixed vacuum-tightly to a plasma reaction chamber. After completion of the treatment, the wafer is taken out by a second movable pick-up means and carried away by another carrier means to the succeeding processing step. Thus a possibility of full automatization of wafer processing is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.