Patent · US Expired

Process for machining silicon rods and tubes by abrasion

US4211040A · kind A · utility

4Cited by

6References

2Claims

0Family size

Assignee

Wacker-Chemitronic Gesellschaft fur Elektronik Grundstoffe mbH · DE

Inventors

Friedrich Steudten · Burghausen, DE
Franz Koppl · Altötting, DE

Key dates

Filing date	Oct 27, 1978
Grant date	Jul 8, 1980
Priority date	—
Expiry date	Oct 27, 1998

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB28D5/00
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

The invention provides a process and an apparatus for machining silicon r and tubes by abrasion. The risk of fracture of such workpieces during grinding is prevented in this method and apparatus by the workpiece being held vertically in a cylindrical grinding machine in which the individual tools are uniformly arranged around the circumference of the workpiece in such a manner that their contact pressures are mutually substantially compensated.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.