Chemical copper plating solution
US4211564A · kind A · utility
11Cited by
4References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 18, 1979 |
| Grant date | Jul 8, 1980 |
| Priority date | — |
| Expiry date | Apr 18, 1999 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/405
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An aqueous plating solution consists essentially of a copper ion-releasing compound, a copper ion-complexing agent, a copper ion-reducing agent, a hydroxide of alkali metal, 2,2'-dipyridyl, polyethyleneglycolstearylamine, and silver sulfide has a good liquid stability and a high plating speed, and a chemical copper plating film obtained from the plating solution has a high toughness (tensile strength.times.elongation).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.