Hitoshi Oka
35Patents
14h-index
71Co-inventors
84Inventor score
Filing activity: Apr 18, 1979 → Apr 28, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5979475A | Specimen holding method and fluid treatment method of specimen surface and systems therefor | Electricity | 63 | Expired |
| US5388328A | Process for fabricating an interconnected multilayer board | Emerging Cross-Sectional Technologies | 39 | Expired |
| US5300735A | Interconnected multilayer boards and fabrication processes thereof | Emerging Cross-Sectional Technologies | 23 | Expired |
| US6401734B1 | Substrate treating apparatus | Emerging Cross-Sectional Technologies | 22 | Expired |
| US6431190B1 | Fluid processing apparatus | Emerging Cross-Sectional Technologies | 22 | Expired |
| US5256247A | Liquid etchant composition for thin film resistor element | Chemistry; Metallurgy | 20 | Expired |
| US5348590A | Surface treating agent for copper or copper alloys | Electricity | 18 | Expired |
| US4324629A | Process for regenerating chemical copper plating solution | Emerging Cross-Sectional Technologies | 17 | Expired |
| US4303443A | Electroless copper plating solution | Chemistry; Metallurgy | 16 | Expired |
| US4563217A | Electroless copper plating solution | Chemistry; Metallurgy | 16 | Expired |
| US5387493A | Photosensitive resin composition for forming conductor patterns and multilayer circuit boards using same | Electricity | 16 | Expired |
| US4276323A | Process for controlling of chemical copper plating solution | Chemistry; Metallurgy | 16 | Expired |
| US4460718A | Epoxy resin composition | Electricity | 15 | Expired |
| US5409544A | Method of controlling adhesion of fine particles to an object in liquid | Emerging Cross-Sectional Technologies | 14 | Expired |
| US4828451A | Industrial robot | Physics | 12 | Expired |
| US6443168B1 | Plate-like specimen fluid-treating apparatus and plate-like specimen fluid-treating method | Emerging Cross-Sectional Technologies | 11 | Expired |
| US4211564A | Chemical copper plating solution | Chemistry; Metallurgy | 11 | Expired |
| US5268255A | Photo-setting resist composition, a process for producing a printed circuit board by using the composition, and a printed circuit board obtained by using the composition | Emerging Cross-Sectional Technologies | 9 | Expired |
| US4347304A | Process for forming metallic image | Emerging Cross-Sectional Technologies | 8 | Expired |
| US6461532B1 | Piezoelectric ceramic material | Chemistry; Metallurgy | 8 | Expired |
| US6241908A | Piezoelectric ceramics | Chemistry; Metallurgy | 8 | Expired |
| US4555532A | Epoxy resin composition | Electricity | 8 | Expired |
| US4735853A | Magnetic recording medium having an amorphous, nonmagnetic nickel-tungston-phosphorus underlayer | Emerging Cross-Sectional Technologies | 7 | Expired |
| US6129886A | Method of preparation of piezoelectric ceramics | Electricity | 7 | Expired |
| US6315836A | Clean, recirculating processing method which prevents surface contamination of an object | Emerging Cross-Sectional Technologies | 5 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.