Method of improving the adhesion of electroless metal deposits employing colloidal copper activator
US4233344A · kind A · utility
13Cited by
9References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 20, 1978 |
| Grant date | Nov 11, 1980 |
| Priority date | — |
| Expiry date | Jul 20, 1998 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/28
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a method for promoting and improving the adhesion of an electroless metal deposit to the metal surface of a composite substrate having both a conductive metal area and an activated non-conductive surface. The process comprises treating such a substrate, subsequent to catalyzation or activation of the substrate, and prior to electroless metal deposition thereon, with an adhesion promotor compound or mixture of compounds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.