Learonal, Inc.
🏢 View company profile →61Patents
0Active
61Granted
37Portfolio score
Filing activity: Dec 20, 1974 → Feb 8, 1999
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6071398A | Programmed pulse electroplating process | Emerging Cross-Sectional Technologies | 43 | Expired |
| US4565609A | Bath and process for plating tin, lead and tin-lead alloys | Electricity | 38 | Expired |
| US4871429A | Limiting tin sludge formation in tin or tin/lead electroplating solutions | Electricity | 35 | Expired |
| US4565610A | Bath and process for plating lead and lead/tin alloys | Electricity | 31 | Expired |
| US5174887A | High speed electroplating of tinplate | Mechanical Engineering; Lighting; Heating | 29 | Expired |
| US4000047A | Electrodeposition of tin, lead and tin-lead alloys | Chemistry; Metallurgy | 28 | Expired |
| US4617097A | Process and electrolyte for electroplating tin, lead or tin-lead alloys | Electricity | 25 | Expired |
| US5312539A | Electrolytic tin plating method | Emerging Cross-Sectional Technologies | 24 | Expired |
| US4628165A | Electrical contacts and methods of making contacts by electrodeposition | Emerging Cross-Sectional Technologies | 23 | Expired |
| US4378270A | Method of etching circuit boards and recovering copper from the spent etch solutions | Chemistry; Metallurgy | 21 | Expired |
| US4717460A | Tin lead electroplating solutions | Electricity | 20 | Expired |
| US4599149A | Process for electroplating tin, lead and tin-lead alloys and baths therefor | Electricity | 19 | Expired |
| US5750018A | Cyanide-free monovalent copper electroplating solutions | Chemistry; Metallurgy | 17 | Expired |
| US5256275A | Electroplated gold-copper-silver alloys | Chemistry; Metallurgy | 17 | Expired |
| US5106473A | Process for metallizing a through-hole board | Electricity | 17 | Expired |
| US6210556A | Electrolyte and tin-silver electroplating process | Electricity | 17 | Expired |
| US4847114A | Preparation of printed circuit boards by selective metallization | Electricity | 17 | Expired |
| US4681670A | Bath and process for plating tin-lead alloys | Electricity | 16 | Expired |
| US4640746A | Bath and process for plating tin/lead alloys on composite substrates | Electricity | 16 | Expired |
| US5901997A | Conveyor device for vertically guiding plate-like objects for electroylic surface-treatment | Performing Operations; Transporting | 16 | Expired |
| US5066367A | Limiting tin sludge formation in tin or tin/lead electroplating solutions | Electricity | 15 | Expired |
| US4701244A | Bath and process for electroplating tin, lead and tin/alloys | Electricity | 15 | Expired |
| US4591415A | Plating baths and methods for electro-deposition of gold or gold alloys | Chemistry; Metallurgy | 14 | Expired |
| US3972787A | Palladium electrolyte baths utilizing quaternized pyridine compounds as brighteners | Chemistry; Metallurgy | 14 | Expired |
| US4233344A | Method of improving the adhesion of electroless metal deposits employing colloidal copper activator | Chemistry; Metallurgy | 13 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.