Sealing of integrated circuit modules
US4233620A · kind A · utility
18Cited by
3References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 1979 |
| Grant date | Nov 11, 1980 |
| Priority date | — |
| Expiry date | Feb 27, 1999 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The hermetic seal of the backside of a substrate of an integrated circuit module is provided by a composition containing about 51.4 to about 60.6% by weight of an epoxy polymer; about 39 to about 48% by weight of a hardener and flexibilizing portion; and up to about 0.6% by weight of a coloring agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.