Irving Memis
35Patents
13h-index
47Co-inventors
81Inventor score
Filing activity: Dec 15, 1975 → Mar 10, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5847929A | Attaching heat sinks directly to flip chips and ceramic chip carriers | Electricity | 104 | Expired |
| US6069023A | Attaching heat sinks directly to flip chips and ceramic chip carriers | Electricity | 74 | Expired |
| US6664485B2 | Full additive process with filled plated through holes | Emerging Cross-Sectional Technologies | 55 | Expired |
| US6162997A | Circuit board with primary and secondary through holes | Electricity | 41 | Expired |
| US6251707A | Attaching heat sinks directly to flip chips and ceramic chip carriers | Electricity | 35 | Expired |
| US5189261A | Electrical and/or thermal interconnections and methods for obtaining such | Emerging Cross-Sectional Technologies | 29 | Expired |
| US7294791B2 | Circuitized substrate with improved impedance control circuitry, method of making same, electrical assembly and information handling system utilizing same | Emerging Cross-Sectional Technologies | 25 | Expired |
| US4048356A | Hermetic topsealant coating and process for its formation | Emerging Cross-Sectional Technologies | 18 | Expired |
| US5532024A | Method for improving the adhesion of polymeric adhesives to nickel surfaces | Chemistry; Metallurgy | 18 | Expired |
| US4233620A | Sealing of integrated circuit modules | Electricity | 18 | Expired |
| US6195883A | Full additive process with filled plated through holes | Emerging Cross-Sectional Technologies | 17 | Expired |
| US5414928A | Method of making an electronic package assembly with protective encapsulant material | Emerging Cross-Sectional Technologies | 16 | Expired |
| US5965944A | Printed circuit boards for mounting a semiconductor integrated circuit die | Emerging Cross-Sectional Technologies | 15 | Expired |
| US7791897B2 | Multi-layer embedded capacitance and resistance substrate core | Emerging Cross-Sectional Technologies | 13 | Active |
| US6418616B2 | Full additive process with filled plated through holes | Emerging Cross-Sectional Technologies | 12 | Expired |
| US6650016B1 | Selective C4 connection in IC packaging | Electricity | 11 | Expired |
| US7119003B2 | Extension of fatigue life for C4 solder ball to chip connection | Electricity | 9 | Expired |
| US6391210B2 | Process for manufacturing a multi-layer circuit board | Electricity | 9 | Expired |
| US7470990B2 | Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same | Electricity | 7 | Expired |
| US7589283B2 | Method of making circuitized substrate with improved impedance control circuitry, electrical assembly and information handling system | Emerging Cross-Sectional Technologies | 6 | Active |
| US4971894A | Method and structure for preventing wet etchant penetration at the interface between a resist mask and an underlying metal layer | Emerging Cross-Sectional Technologies | 4 | Expired |
| US7145221B2 | Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same | Electricity | 4 | Expired |
| US7454833B2 | High performance chip carrier substrate | Emerging Cross-Sectional Technologies | 4 | Active |
| US6919635B2 | High density microvia substrate with high wireability | Electricity | 4 | Expired |
| US6965170B2 | High wireability microvia substrate | Electricity | 4 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.