Method of making multilayered glass-ceramic structures having an internal distribution of copper-based conductors
US4234367A · kind A · utility
79Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 1979 |
| Grant date | Nov 18, 1980 |
| Priority date | — |
| Expiry date | Mar 23, 1999 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4676
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The formation of sintered glass-ceramic substrates containing multi-level, interconnected thick-film circuit patterns of copper-based conductors obtained by firing in a controlled ambient of hydrogen and H.sub.2 O at temperatures below the melting point of copper.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.