Raj N. Master
52Patents
14h-index
74Co-inventors
87Inventor score
Filing activity: Mar 23, 1979 → Aug 14, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4340436A | Process for flattening glass-ceramic substrates | Electricity | 81 | Expired |
| US4234367A | Method of making multilayered glass-ceramic structures having an internal distribution of copper-based conductors | Electricity | 79 | Expired |
| US4885038A | Method of making multilayered ceramic structures having an internal distribution of copper-based conductors | Electricity | 72 | Expired |
| US4627160A | Method for removal of carbonaceous residues from ceramic structures having internal metallurgy | Emerging Cross-Sectional Technologies | 30 | Expired |
| US6657707B1 | Metallurgical inspection and/or analysis of flip-chip pads and interfaces | Electricity | 27 | Expired |
| US5153408A | Method and structure for repairing electrical lines | Emerging Cross-Sectional Technologies | 23 | Expired |
| US5553766A | In-situ device removal for multi-chip modules | Performing Operations; Transporting | 21 | Expired |
| US8991473B2 | Metal alloy injection molding protrusions | Emerging Cross-Sectional Technologies | 18 | Active |
| US9027631B2 | Metal alloy injection molding overflows | Performing Operations; Transporting | 16 | Active |
| US6103549A | No clean flux for flip chip assembly | Electricity | 16 | Expired |
| US6372544B1 | Method to reduce occurrences of fillet cracking in flip-chip underfill | Electricity | 16 | Expired |
| US4764341A | Bonding of pure metal films to ceramics | Emerging Cross-Sectional Technologies | 15 | Expired |
| US5988485A | Flux cleaning for flip chip technology using environmentally friendly solvents | Electricity | 15 | Expired |
| US6382500B1 | Solder reflow furnace with flux effluent collector and method of preventing flux contamination | Electricity | 14 | Expired |
| US5779133A | In-situ device removal for multi-chip modules | Performing Operations; Transporting | 14 | Expired |
| US7833839B1 | Method for decreasing surface delamination of gel-type thermal interface material by management of the material cure temperature | Electricity | 14 | Active |
| US6229207A | Organic pin grid array flip chip carrier package | Electricity | 14 | Expired |
| US5605277A | Hot vacuum device removal process and apparatus | Performing Operations; Transporting | 14 | Expired |
| US4671928A | Method of controlling the sintering of metal particles | Electricity | 13 | Expired |
| US7544542B2 | Reduction of damage to thermal interface material due to asymmetrical load | Electricity | 13 | Active |
| US5543584A | Structure for repairing electrical lines | Emerging Cross-Sectional Technologies | 13 | Expired |
| US4776978A | Method of controlling the sintering of metal particles | Emerging Cross-Sectional Technologies | 12 | Expired |
| US7651938B2 | Void reduction in indium thermal interface material | Electricity | 11 | Active |
| US7678615B2 | Semiconductor device with gel-type thermal interface material | Electricity | 9 | Active |
| US6617195B1 | Method of reflowing organic packages using no-clean flux | Electricity | 7 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.