Coating composition for forming insulating film on electroconductive substrate for printed circuits and method therefor
US4238385A · kind A · utility
14Cited by
3References
1Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Aug 14, 1979 |
| Grant date | Dec 9, 1980 |
| Priority date | — |
| Expiry date | Aug 14, 1999 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0209
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
This invention is directed to coating compositions for electrocoating electroconductive substrates for printed circuits comprising a pigment-containing finely divided synthetic resin powder in which the resin comprises an epoxy resin, and the pigment comprises pigments with 2-10 weight parts of finely divided silica, admixed with a water-dilutable cationic resin, and to methods of utilizing the composition for forming an insulating film on an electroconductive substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.