Microcircuit package formed of multi-components
US4262300A · kind A · utility
3Cited by
11References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 3, 1978 |
| Grant date | Apr 14, 1981 |
| Priority date | — |
| Expiry date | Nov 3, 1998 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-component microcircuit package is formed from a plurality of separate components which are secured together to form a lower package portion using a base and a continuous composite side wall frame having irregularities on its upper surface as a result of the component junctions. Secured to the top of this side wall frame is a one-piece continuous top frame member having a uniform upper surface. This top frame member covers the irregularities present in side wall frame and provides a surface more suitable for hermetic sealing of a package lid to the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.