Isotronics, Inc.
13Patents
0Active
13Granted
29Portfolio score
Filing activity: Apr 17, 1975 → Dec 29, 1989
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5015207A | Multi-path feed-thru lead and method for formation thereof | Emerging Cross-Sectional Technologies | 36 | Expired |
| US4487999A | Microwave chip carrier | Emerging Cross-Sectional Technologies | 35 | Expired |
| US4453033A | Lead grounding | Emerging Cross-Sectional Technologies | 24 | Expired |
| US4451540A | System for packaging of electronic circuits | Emerging Cross-Sectional Technologies | 21 | Expired |
| US4266090A | All metal flat package | Emerging Cross-Sectional Technologies | 20 | Expired |
| US4991291A | Method for fabricating a fold-up frame | Emerging Cross-Sectional Technologies | 16 | Expired |
| US4716082A | Duplex glass preforms for hermetic glass-to-metal sealing | Electricity | 15 | Expired |
| US4008945A | Ultraviolet-transmitting window for a PROM | Electricity | 15 | Expired |
| US4412093A | Microcircuit flat pack with integral shell | Emerging Cross-Sectional Technologies | 15 | Expired |
| US4788382A | Duplex glass preforms for hermetic glass-to-metal compression sealing | Electricity | 15 | Expired |
| US4266089A | All metal flat package having excellent heat transfer characteristics | Emerging Cross-Sectional Technologies | 12 | Expired |
| US4547624A | Method and apparatus for reducing package height for microcircuit packages | Electricity | 11 | Expired |
| US4262300A | Microcircuit package formed of multi-components | Electricity | 3 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.