All metal flat package having excellent heat transfer characteristics
US4266089A · kind A · utility
12Cited by
6References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 14, 1978 |
| Grant date | May 5, 1981 |
| Priority date | — |
| Expiry date | Sep 14, 1998 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An all-metal flat package for microcircuits is described which has a copper bottom and a stainless steel frame. Beryllia substrates carrying power chips can readily be soldered into the package which has good heat transfer characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.