All metal flat package
US4266090A · kind A · utility
20Cited by
6References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 14, 1978 |
| Grant date | May 5, 1981 |
| Priority date | — |
| Expiry date | Sep 14, 1998 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49211
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An all-metal flat package for microcircuits is described which has a molybdenum bottom and a Kovar frame. Large 96% alumina substrates carrying heat dissipating microcircuits can readily be soldered into the package which has good transfer characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.