Process for controlling of chemical copper plating solution
US4276323A · kind A · utility
16Cited by
3References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 1979 |
| Grant date | Jun 30, 1981 |
| Priority date | — |
| Expiry date | Dec 21, 1999 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/1617
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A concentration of copper ions, a concentration of a reducing agent, a concentration of a complexing agent and a pH of a chemical copper plating solution are continuously detected all as potentials, and continuously controlled with a good accuracy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.