Automatic wafer processing system and method
US4278366A · kind A · utility
28Cited by
6References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 18, 1977 |
| Grant date | Jul 14, 1981 |
| Priority date | — |
| Expiry date | Mar 18, 1997 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC30B35/005
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An automatic wafer processing system is modular in format and includes wafer treatment units, storage units and air bearing transport track units which are all of a common module size or an integral multiple thereof. All of these units can then be operatively interconnected in a coplanar configuration to provide an automated wafer flow path. Variation of treatment units can provide many different types of wafer processing in a simple and economical manner. To facilitate such automated system improved variable width air bearing tracks are provided along with a buffer storage unit to accommodate differing process times.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.