IC Package with heat sink and minimal cross-sectional area
US4278991A · kind A · utility
12Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 13, 1979 |
| Grant date | Jul 14, 1981 |
| Priority date | — |
| Expiry date | Aug 13, 1999 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is an IC package for connecting one set of nodes on an IC chip to another corresponding set of nodes on a circuit board. Each interconnection is made with a single C-shaped lead which is bonded at one end to a node on the chip. These leads extend outward from the periphery of the chip's surface, then perpendicular to and away from the chip's surface, and then inwards towards each other. A heat sink attaches to the back of the chip. The chip, an adjacent portion of the heat sink, and the outward extending portion of the leads are then encapsulated with a solid mass to hold them rigidly in place.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.