Daniel M. Andrews
8Patents
7h-index
8Co-inventors
52Inventor score
Filing activity: Aug 13, 1979 → Jan 31, 1991
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4776509A | Single point bonding method and apparatus | Electricity | 57 | Expired |
| US5072874A | Method and apparatus for using desoldering material | Electricity | 37 | Expired |
| US4845335A | Laser Bonding apparatus and method | Electricity | 31 | Expired |
| US4934582A | Method and apparatus for removing solder mounted electronic components | Electricity | 25 | Expired |
| US4852250A | Hermetically sealed package having an electronic component and method of making | Emerging Cross-Sectional Technologies | 25 | Expired |
| US4991286A | Method for replacing defective electronic components | Emerging Cross-Sectional Technologies | 13 | Expired |
| US4278991A | IC Package with heat sink and minimal cross-sectional area | Electricity | 12 | Expired |
| US5029747A | Apparatus for replacing defective electronic components | Electricity | 7 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.